Additively Manufactured Electronics (AME)

The term Additively Manufactured Electronics (AME) refers to the additive manufacturing of electronic components, antennas and circuits.

This principle was recently combined with that of mechatronic integrated devices (MID) in the EXIST research transfer project Mesmeronic at the Fraunhofer IAPT. MIDs combine mechanical and electrical components on three-dimensional bodies and surfaces, thus enabling complex, compact and highly integrated components. Overall, the Mesmeronic project dealt with the additive manufacturing of three-dimensional MIDs, a combination of AME and MID.

The component is designed according to the customer's wishes. We are proud to support our customers and cooperation partners with innovative processes. Our customized approach and expertise allow us to develop unique solutions that meet specific requirements and result in complex, lightweight and highly integrated components.

After the design, the additive manufacturing of the base body takes place. As a rule, PA12 is used in the MMR process chain in the SLS process, but other thermoplastics and processes, such as FFF, are already under development. The component is smoothed after printing and pre-treated for the subsequent step, laser beam activation. Here, a laser activates the conductor tracks, pads, etc., which are built up with copper in the chemical metallization step and protected against corrosion with a nickel-gold layer.

In the final step, the electronic components are mounted on the pads.

After a few quality assurance checks, the additively manufactured 3D-MID component is ready for use.

Demonstrators:

Several technology demonstrators and products have been created as part of the project, not all of which can be named publicly.

Two demonstrators designed for trade fairs and conferences are the MIDster and a fidget spinner. These contain several LEDs, transistors, resistors, a button, a power source and a microcontroller. At the push of a button, the LEDs are controlled in different patterns by the freely programmable microcontroller.

Another example is the minimum viable product (MVP) “batAME”, a functional 3D-MID battery housing cover from the electromobility sector manufactured using the MMR process chain, which was developed in collaboration with EDAG. Its task is to seal the battery box, in which the individual cells are lined up and the required electronics are installed, and to protect the inner workings from external mechanical influences. The electronics integrated in the 3D-MID battery housing cover continuously monitor the battery status using temperature sensors and regulate the charging and discharging process.

The research results obtained open up new possibilities for the development of innovative and highly integrated systems in which mechanical and electronic components are perfectly matched to additively manufactured 3D base bodies. Use the knowledge gained to take your products to the next level. Contact us for more information or a partnership to integrate this groundbreaking technology into your projects!